![12345.png](/../../upload/image/20240412/6384853562739303657452130.png)
Design features:
• Simulation-assisted optimization of flow channel design to meet pressure drop, flow, and heat distribution requirements
• Extensive experience in manifold, piping, and thermally conductive material integration
• Exclusive design for batteries or electronic components
• Rich experience in the design and manufacture of large plates
Technical parameters
Applicable medium | Refrigerant/coolant |
Environment temperature | -40 ℃ to 120 ℃ |
Product thickness | 4 mm to 9 mm |
Maximum width | 1.6m |
Maxlength | 2.5m
|
Planeness | < 0.5 mm in 0.2 m² area |
Leakage capacity | ≤ 8.8 × 10^-6 mbar·L/s |